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Simulation and prediction on phonon thermal conductivity of Al/Cu interface
Xu, Zhaomei[1]; Ge, Daohan[2]; Zhang, Liqiang[3]
刊名JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS
2018
卷号122页码:184-188
关键词Phonon thermal conductivity Interface Al/Cu Mathematical approximate model Molecular dynamics
ISSN号0022-3697
DOIhttp://dx.doi.org/10.1016/j.jpcs.2018.06.027
URL标识查看原文
收录类别SCI(E) ; EI
WOS记录号WOS:000440881800022
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/5333368
专题江苏大学
作者单位1.[1]Huaiyin Inst Technol, Jiangsu Key Lab Adv Mfg Technol, Huaian 223003, Peoples R China.
2.[2]Univ New South Wales, Sch Chem, Sydney, NSW 2052, Australia.
3.Jiangsu Univ, Micro Nano Sci & Technol Ctr, Sch Mech Engn, Zhenjiang 212013, Peoples R China.
4.[3]Huaiyin Inst Technol, Jiangsu Key Lab Adv Mfg Technol, Huaian 223003, Peoples R China.
5.Jiangsu Univ, Micro Nano Sci & Technol Ctr, Sch Mech Engn, Zhenjiang 212013, Peoples R China.
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Xu, Zhaomei[1],Ge, Daohan[2],Zhang, Liqiang[3]. Simulation and prediction on phonon thermal conductivity of Al/Cu interface[J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS,2018,122:184-188.
APA Xu, Zhaomei[1],Ge, Daohan[2],&Zhang, Liqiang[3].(2018).Simulation and prediction on phonon thermal conductivity of Al/Cu interface.JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS,122,184-188.
MLA Xu, Zhaomei[1],et al."Simulation and prediction on phonon thermal conductivity of Al/Cu interface".JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS 122(2018):184-188.
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