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	Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer
	Wang, Luhua[1]; Li, Jianwei[2]; Catalano, Massimo[3]; Bai, Guangzhu[4]; Li, Ning[5]; Dai, Jingjie[6]; Wang, Xitao[7]; Zhang, Hailong[8]; Wang, Jinguo[9]; Kim, Moon J.[10]
刊名	COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
	2018
卷号	113页码:76-82
关键词	Metal-matrix composites (MMCs) Interface/interphase Thermal properties Electron microscopy
ISSN号	1359-835X
DOI	http://dx.doi.org/10.1016/j.compositesa.2018.07.023
URL标识	查看原文
收录类别	SCI(E) ; EI
WOS记录号	WOS:000444659100007
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5332450
专题	江苏大学
作者单位	1.[1]Univ Sci & Technol Beijing, State Key Lab Adv Met & Mat, Beijing 100083, Peoples R China. 2.Univ Texas Dallas, Dept Mat Sci & Engn, Richardson, TX 75080 USA. 3.[2]Univ Sci & Technol Beijing, State Key Lab Adv Met & Mat, Beijing 100083, Peoples R China. 4.Jiangsu Univ, Inst Adv Mfg & Modern Equipment Technol, Zhenjiang 212013, Peoples R China. 5.[3]Univ Texas Dallas, Dept Mat Sci & Engn, Richardson, TX 75080 USA. 6.Natl Council Res, Inst Microelect & Microsyst, Via Monteroni, I-73100 Lecce, Italy. 7.[4]Univ Sci & Technol Beijing, State Key Lab Adv Met & Mat, Beijing 100083, Peoples R China. 8.[5]Univ Sci & Technol Beijing, State Key Lab Adv Met & Mat, Beijing 100083, Peoples R China. 9.[6]Qingdao Binhai Univ, Sch Mech & Elect Engn, Qingdao 266555, Peoples R China. 10.[7]Univ Sci & Technol Beijing, State Key Lab Adv Met & Mat, Beijing 100083, Peoples R China.
推荐引用方式 GB/T 7714	Wang, Luhua[1],Li, Jianwei[2],Catalano, Massimo[3],et al. Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer[J]. COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING,2018,113:76-82.
APA	Wang, Luhua[1].,Li, Jianwei[2].,Catalano, Massimo[3].,Bai, Guangzhu[4].,Li, Ning[5].,...&Kim, Moon J.[10].(2018).Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer.COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING,113,76-82.
MLA	Wang, Luhua[1],et al."Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer".COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING 113(2018):76-82.

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