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	Method for dicing a diced optoelectronic semiconductor wafer
	CHENG, CHIH-CHING; TSAI, CHIUNG-CHI
	2012-03-27
著作权人	EPISTAR CORPORATION
专利号	US8143081
国家	美国
文献子类	授权发明
其他题名	Method for dicing a diced optoelectronic semiconductor wafer
英文摘要	A method for dicing an optoelectronic semiconductor wafer has steps of preparing an optoelectronic semiconductor wafer, laser scribing, diamond saw dicing and forming optoelectronic semiconductor dies. A product for dicing an optoelectronic semiconductor wafer has a substrate and an epitaxial layer. The substrate has a first surface, a second surface and two rough surfaces. The rough surfaces are formed by laser scribing the wafer to define multiple guide grooves on the wafer and diamond saw grooving the wafer along the guide grooves. The epitaxial layer is formed epitaxially on the first surface of the substrate.
公开日期	2012-03-27
申请日期	2007-02-13
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/38338]
专题	半导体激光器专利数据库
作者单位	EPISTAR CORPORATION
推荐引用方式 GB/T 7714	CHENG, CHIH-CHING,TSAI, CHIUNG-CHI. Method for dicing a diced optoelectronic semiconductor wafer. US8143081. 2012-03-27.

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