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	Light emitting package having phosphor layer over a transparent resin layer
	KIM, KI SEOK; KIM, WON JUNG; SONG, JUNE O; LIM, CHANG MAN
	2019-05-21
著作权人	LG INNOTEK CO., LTD.
专利号	US10297725
国家	美国
文献子类	授权发明
其他题名	Light emitting package having phosphor layer over a transparent resin layer
英文摘要	The embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus. According to another embodiment, there is provided a light emitting device package which includes a package body (110) including a frame (111, 112) and a body (113); a light emitting device (120) including first and second bonding parts (121, 122) and disposed on the body (113); a reflective resin layer disposed between the light emitting device and a side surface of a cavity (C) formed in the body; a transparent resin layer on the light emitting device; and a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device.
公开日期	2019-05-21
申请日期	2017-09-29
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/38032]
专题	半导体激光器专利数据库
作者单位	LG INNOTEK CO., LTD.
推荐引用方式 GB/T 7714	KIM, KI SEOK,KIM, WON JUNG,SONG, JUNE O,et al. Light emitting package having phosphor layer over a transparent resin layer. US10297725. 2019-05-21.

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