Light emitting device including a lead frame and an insulating material
LI, SHU; VU, THUY
2019-08-13
著作权人LUMILEDS LLC
专利号US10381534
国家美国
文献子类授权发明
其他题名Light emitting device including a lead frame and an insulating material
英文摘要Embodiments of the invention include a package for a light emitting diode (LED). The package includes a lead frame, an LED, and an optically reflective but electrically non-conductive molding. The lead frame has a first lead frame part and a second lead frame part electrically isolated from the first lead frame part, each lead frame part having at least one raised pillar. The molding is disposed over the lead frame except over the pillars of the lead frame. The LED is mounted on at least one pillar and is electrically coupled to at least one pillar. The molding serves the purpose of a highly reflective, electrically conductive material like silver without being subject to tarnishing.
公开日期2019-08-13
申请日期2017-07-18
状态授权
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/38009]  
专题半导体激光器专利数据库
作者单位LUMILEDS LLC
推荐引用方式
GB/T 7714
LI, SHU,VU, THUY. Light emitting device including a lead frame and an insulating material. US10381534. 2019-08-13.
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