| Tooling for coupling multiple electronic chips | |
| DUGAS, ROGER; TREZZA, JOHN | |
| 2017-09-05 | |
| 著作权人 | CUFER ASSET LTD. L.L.C. |
| 专利号 | US9754907 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Tooling for coupling multiple electronic chips |
| 英文摘要 | A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface. |
| 公开日期 | 2017-09-05 |
| 申请日期 | 2016-04-20 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37884]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CUFER ASSET LTD. L.L.C. |
| 推荐引用方式 GB/T 7714 | DUGAS, ROGER,TREZZA, JOHN. Tooling for coupling multiple electronic chips. US9754907. 2017-09-05. |
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