Photonic integrated circuit using chip integration
CHANG, CHIA-MING; DE VALICOURT, GUILHEM
2017-09-12
著作权人ALCATEL-LUCENT USA INC.
专利号US9762334
国家美国
文献子类授权发明
其他题名Photonic integrated circuit using chip integration
英文摘要We disclose a photonic integrated circuit (PIC) having a first photonic chip and a second photonic chip that are bonded and optically coupled to one another in a manner that reduces the number of different photonic chips that need to be integrated into the same PIC package to achieve a desired electro-optical function. In an example embodiment, the first photonic chip may include active optical components, such as lasers and optical amplifiers, and be fabricated using the III-V semiconductor technology. The second photonic chip may include additional optical components, such as modulators, photodetectors, and passive optical components, and be fabricated using the CMOS technology. The second photonic chip may also include one or more 2×2 optical couplers configured to appropriately (re)direct various optical signals between the active optical components of the first photonic chip and the additional optical components of the second photonic chip to achieve the desired electro-optical function.
公开日期2017-09-12
申请日期2015-12-31
状态授权
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/37859]  
专题半导体激光器专利数据库
作者单位ALCATEL-LUCENT USA INC.
推荐引用方式
GB/T 7714
CHANG, CHIA-MING,DE VALICOURT, GUILHEM. Photonic integrated circuit using chip integration. US9762334. 2017-09-12.
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