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	Communication module-cooling structure and communication device
	SUNAGA, YOSHINORI; ISHIGAMI, YOSHIAKI; YAMAZAKI, KINYA; YONEZAWA, HIDENORI
	2016-04-19
著作权人	HITACHI METALS, LTD.
专利号	US9320170
国家	美国
文献子类	授权发明
其他题名	Communication module-cooling structure and communication device
英文摘要	A communication module-cooling structure includes a main body section to be cooled by a cooling mechanism, and a heat sink including a cooling receiving section including partition walls and slit-shaped receiving spaces defined by the partition walls. The receiving spaces of the cooling receiving section receive communication modules, and each of the communication modules includes a substrate mounted with a communication circuit component thereon and first and second sidewalls which sandwich the substrate therebetween in a thickness direction of the substrate. At least one of the first and second sidewalls of each of the communication modules is in surface contact with an inner surface of each of the receiving spaces.
公开日期	2016-04-19
申请日期	2013-07-17
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37688]
专题	半导体激光器专利数据库
作者单位	HITACHI METALS, LTD.
推荐引用方式 GB/T 7714	SUNAGA, YOSHINORI,ISHIGAMI, YOSHIAKI,YAMAZAKI, KINYA,et al. Communication module-cooling structure and communication device. US9320170. 2016-04-19.

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