| Package for housing electronic component and electronic device | |
| TANAKA, NOBUYUKI; TAKAYA, SHIGENORI | |
| 2016-05-24 | |
| 著作权人 | KYOCERA CORPORATION |
| 专利号 | US9351422 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Package for housing electronic component and electronic device |
| 英文摘要 | A package 10 includes a housing 1 in which an electronic component 5 is mounted in a recess 1a having an opening on an upper surface and a screwing section 31 that is fixed on a side face of the housing 1 and extends in a lateral direction. The screwing section 31 includes a thin section 34 which is located on a distal end and is provided with a through hole 36 through which a screw is inserted, a thick section 35 which is located between the thin section 34 and the side face of the housing 1 and has a thickness less than that of the side face of the housing 1 and thicker than that of the thin section 34, and a screw fastening hole 37 which extends in the vertical direction in the thick section 35. Even if the housing 1 has warpage when the package 10 is fixed on the external substrate, heat dissipation from the package to the external substrate can be improved. |
| 公开日期 | 2016-05-24 |
| 申请日期 | 2013-01-22 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37636]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KYOCERA CORPORATION |
| 推荐引用方式 GB/T 7714 | TANAKA, NOBUYUKI,TAKAYA, SHIGENORI. Package for housing electronic component and electronic device. US9351422. 2016-05-24. |
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