| Heat sink for a pulsed high-power laser diode | |
| HERDEN, WERNER; SCHWARZ, HANS-JOCHEN; PITTROFF, WOLFGANG | |
| 2014-11-18 | |
| 著作权人 | ROBERT BOSCH GMBH |
| 专利号 | US8891567 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Heat sink for a pulsed high-power laser diode |
| 英文摘要 | A semiconductor laser module having a substrate and having at least one semiconductor laser situated on the substrate, the substrate having a layer structure which includes at least one primary layer which establishes a thermal contact with the semiconductor laser. The semiconductor laser is designed in such a way that it emits heat pulses having a minimum specific heat of approximately 3 mJ per mm2, preferably approximately 5 mJ/mm2, and having a pulse duration of approximately 100 μs to approximately 2,000 μs, and the primary layer has a layer thickness which is between approximately 200 μm and approximately 2,000 μm, preferably between approximately 400 μm and approximately 2,000 μm. |
| 公开日期 | 2014-11-18 |
| 申请日期 | 2010-05-18 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37462]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ROBERT BOSCH GMBH |
| 推荐引用方式 GB/T 7714 | HERDEN, WERNER,SCHWARZ, HANS-JOCHEN,PITTROFF, WOLFGANG. Heat sink for a pulsed high-power laser diode. US8891567. 2014-11-18. |
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