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	Packaging for high power pump laser modules
	YEH, XIAN-LI; CHEN, GANG PAUL
	2005-01-25
著作权人	ARCHCOM TECHNOLOGY, INC.
专利号	US6846113
国家	美国
文献子类	授权发明
其他题名	Packaging for high power pump laser modules
英文摘要	Locally heated low temperature solder glass is used to permanently fix an optical fiber with sub-micron precision to a glass ceramic submount inside a high power pump laser module. The fiber is manipulated into a predetermined alignment while the solder glass is still molten and the solder glass is then cooled to its solidified state. The predetermined alignment may include an offset to compensate for subsequent thermally related dimensional changes as the solder glass cools and solidifies. If necessary, the solder glass can be remelted and the fiber realigned with a different offset if the first alignment attempt is less than optimal. This alignment process has been demonstrated to provide reliable and efficient coupling of an optical fiber to a high power pump laser within very tight tolerances. A similar process can also be applied to other micro-optics assemblies where high precision, high reliability fiber fixing is required.
公开日期	2005-01-25
申请日期	2003-05-15
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/36980]
专题	半导体激光器专利数据库
作者单位	ARCHCOM TECHNOLOGY, INC.
推荐引用方式 GB/T 7714	YEH, XIAN-LI,CHEN, GANG PAUL. Packaging for high power pump laser modules. US6846113. 2005-01-25.

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