| Package and method of manufacturing the same | |
| OOE, SATOSHI; YAMAMOTO, YOSHIYUKI | |
| 2002-11-19 | |
| 著作权人 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 专利号 | US6483040 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Package and method of manufacturing the same |
| 英文摘要 | The present invention provides a package whose heat dissipation performance by a semiconductor device has been improved, which synchronizes with the rapid development of high transmission density in multiplex communications. In place of the conventional package substrate, a substrate formed by a combination of two or more kinds of materials is used, whereby the temperature of a portion at which the temperature tends to rise to become extremely high within the package is selectively dissipated, whereby the heat dissipation performance of the package is efficiently improved. A diamond coated substrate or diamond substrate is used at a portion with an extremely high temperature for dissipating the heat. |
| 公开日期 | 2002-11-19 |
| 申请日期 | 2001-02-22 |
| 状态 | 失效 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36728]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 推荐引用方式 GB/T 7714 | OOE, SATOSHI,YAMAMOTO, YOSHIYUKI. Package and method of manufacturing the same. US6483040. 2002-11-19. |
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