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	Bonding interface layer
	HUANG, XUE; LIANG, DI
	2018-09-18
著作权人	HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
专利号	US10079471
国家	美国
文献子类	授权发明
其他题名	Bonding interface layer
英文摘要	An example device in accordance with an aspect of the present disclosure includes a first layer and a second layer to be bonded to the first layer. The first and second layers are materials that generate gas byproducts when bonded, and the first and/or second layers is/are compatible with photonic device operation based on a separation distance. At least one bonding interface layer is to establish the separation distance for photonic device operation, and is to prevent gas trapping and to facilitate bonding between the first layer and the second layer.
公开日期	2018-09-18
申请日期	2016-07-08
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/35665]
专题	半导体激光器专利数据库
作者单位	HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
推荐引用方式 GB/T 7714	HUANG, XUE,LIANG, DI. Bonding interface layer. US10079471. 2018-09-18.

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