| レーザ加工装置およびその加工方法 | |
| 三瓶 和久 | |
| 2008-07-11 | |
| 著作权人 | トヨタ自動車株式会社 |
| 专利号 | JP4150907B2 |
| 国家 | 日本 |
| 文献子类 | 授权发明 |
| 其他题名 | レーザ加工装置およびその加工方法 |
| 英文摘要 | The present invention provides a laser machining apparatus in a simple structure which can properly carry out laser machining by irradiating a laser beam easily at a predetermined energy density to a machining-target site in a predetermined range, and in addition, which can be downsized and can be kept with easy maintenance and has enhanced durability.The apparatus includes: a semiconductor stack 1 comprising a plurality of semiconductor laser elements; and a controller for controlling emission of the laser beam emitted from each of the semiconductor laser elements. The semiconductor stack 1 is divided into a plurality of blocks B11, B12, B13, B14 in correspondence with the machining-target site of a work piece. The controller controls the irradiation of the laser beam from each of the blocks B11, B12, B13, B14 to be changeable in terms of time. |
| 公开日期 | 2008-09-17 |
| 申请日期 | 2002-02-19 |
| 状态 | 失效 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/33776]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | トヨタ自動車株式会社 |
| 推荐引用方式 GB/T 7714 | 三瓶 和久. レーザ加工装置およびその加工方法. JP4150907B2. 2008-07-11. |
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