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	Method for manufacturing a semiconductor device using a circuit transfer film
	SPITZER, MARK B.; SALERNO, JACK P.; JACOBSEN, JEFFREY; DINGLE, BRENDA; VU, DUY-PHACH; ZAVRACKY, PAUL M.
	1993-11-02
著作权人	KOPIN CORPORATION
专利号	US5258325
国家	美国
文献子类	授权发明
其他题名	Method for manufacturing a semiconductor device using a circuit transfer film
英文摘要	The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of high density and complexity. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in modules.
公开日期	1993-11-02
申请日期	1992-02-13
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/33396]
专题	半导体激光器专利数据库
作者单位	KOPIN CORPORATION
推荐引用方式 GB/T 7714	SPITZER, MARK B.,SALERNO, JACK P.,JACOBSEN, JEFFREY,et al. Method for manufacturing a semiconductor device using a circuit transfer film. US5258325. 1993-11-02.

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