| Packaging structure of laser diode | |
| CHEN, KUAN-MING; WU, SHI-JEN; LU, YIN-DONG | |
| 2019-04-23 | |
| 著作权人 | HIMAX TECHNOLOGIES LIMITED |
| 专利号 | US10270219 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Packaging structure of laser diode |
| 英文摘要 | A packaging structure of a laser diode is provided. The packaging structure of the laser diode includes a laser chip, a first substrate and a second substrate. The first substrate having a first electrode and a second electrode on a first surface of the first substrate, and the laser chip is disposed on the first surface of the first substrate; and a second substrate having a third electrode and a fourth electrode on a second surface of the second substrate, wherein the first electrode and the second electrode are electrically connected to the third electrode and the fourth electrode by a wireless-bonding process, respectively. |
| 公开日期 | 2019-04-23 |
| 申请日期 | 2018-02-12 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/32368]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HIMAX TECHNOLOGIES LIMITED |
| 推荐引用方式 GB/T 7714 | CHEN, KUAN-MING,WU, SHI-JEN,LU, YIN-DONG. Packaging structure of laser diode. US10270219. 2019-04-23. |
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