| eta-eta' Transformation of Interfacial Cu6Sn5 in Solder Joints | |
| Luo, Zhongbing; Zhao, Jie; Fu, Qinqin; Wang, Lai | |
| 2010 | |
| 会议名称 | 11th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) |
| 会议日期 | 2010-01-01 |
| 会议地点 | Xian, PEOPLES R CHINA |
| 页码 | 1097-1101 |
| 会议录 | 11th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP)
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| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5271320 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116085, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Luo, Zhongbing,Zhao, Jie,Fu, Qinqin,et al. eta-eta' Transformation of Interfacial Cu6Sn5 in Solder Joints[C]. 见:11th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP). Xian, PEOPLES R CHINA. 2010-01-01. |
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