Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film

CORC > 西安光学精密机械研究所 > 中国科学院西安光学精密机械研究所 > 瞬态光学技术国家重点实验室

	Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film
	Liu Bo 1; Yang Jijun 1; Jiao Guohua 2; Hu Kewei 3
刊名	plasma science & technology
	2012-07-01
卷号	14 期号:7 页码:619-623
关键词	interfacial adhesion thermal stability self-aligned CuSiN process diffusion barrier
ISSN号	1009-0630
产权排序	2
合作状况	国内
英文摘要	a highly reliable interface of self-aligned barrier cusin thin layer between the cu film and the nano-porous sic:h (p-sic:h) capping barrier (k=3.3) has been developed in the present work. with the introduction of self-aligned barrier (sab) cusin between a cu film and a p-sic:h capping barrier, the interfacial thermal stability and the adhesion of the cu/p-sic:h film are considerably enhanced. a significant improvement of adhesion strength and thermal stability of cu/p-sic:h/sioc:h film stack has been achieved by optimizing the pre-clean step before cap-layer deposition and by forming the cusin-like phase. this cap layer on the surface of the cu can provide a more cohesive interface and effectively suppress cu atom migration as well.
WOS标题词	science & technology ; physical sciences
类目[WOS]	physics, fluids & plasmas
研究领域[WOS]	physics
关键词[WOS]	nano-scratch technique ; nm technology node ; carbon-films ; interconnects ; resistance ; diffusion ; barriers
收录类别	SCI ; EI
语种	英语
WOS记录号	WOS:000307123300012
公开日期	2012-12-04
内容类型	期刊论文
源URL	[http://ir.opt.ac.cn/handle/181661/20419]
专题	西安光学精密机械研究所_瞬态光学技术国家重点实验室
作者单位	1.Sichuan Univ, Inst Nucl Sci & Technol, Minist Educ, Key Lab Radiat Phys & Technol, Chengdu 610064, Peoples R China 2.Chinese Acad Sci, Xian Inst Opt & Precis Mech, State key Lab Transient Opt & Photon, Xian 710049, Peoples R China 3.Xi An Jiao Tong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China
推荐引用方式 GB/T 7714	Liu Bo,Yang Jijun,Jiao Guohua,et al. Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film[J]. plasma science & technology,2012,14(7):619-623.
APA	Liu Bo,Yang Jijun,Jiao Guohua,&Hu Kewei.(2012).Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film.plasma science & technology,14(7),619-623.
MLA	Liu Bo,et al."Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film".plasma science & technology 14.7(2012):619-623.