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Simulation analysis on vibration mode of X-PLY corrugated paperboard in transportation engineering
Xia, Rong Hou; Guo, Yan Feng; Sun, De Qiang; Chen, Da Bin
2013
会议名称2013 3rd International Symposium on Chemical Engineering and Material Properties, ISCEMP 2013
会议日期2013-06-22
会议地点Sanya, China
页码1084-1087
URL标识查看原文
内容类型会议论文
URI标识http://www.corc.org.cn/handle/1471x/5002917
专题西安理工大学
推荐引用方式
GB/T 7714
Xia, Rong Hou,Guo, Yan Feng,Sun, De Qiang,et al. Simulation analysis on vibration mode of X-PLY corrugated paperboard in transportation engineering[C]. 见:2013 3rd International Symposium on Chemical Engineering and Material Properties, ISCEMP 2013. Sanya, China. 2013-06-22.
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