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	Effect of cluster interface structure on the spontaneous escape behavior of silver in ion plating coatings and its inhibition mechanism
	Shao, Wenting; Jiang, Bailing; Ma, Jun; Zhang, Xinyu
	2018
卷号	664页码:6-11
关键词	Silver doping Cluster interface structure Ion plating coating Spontaneous escape behavior Inhibition mechanism Conductivity
ISSN号	0040-6090
DOI	10.1016/j.tsf.2018.08.027
URL标识	查看原文
WOS记录号	WOS:000444839700002
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4974237
专题	西安理工大学
推荐引用方式 GB/T 7714	Shao, Wenting,Jiang, Bailing,Ma, Jun,et al. Effect of cluster interface structure on the spontaneous escape behavior of silver in ion plating coatings and its inhibition mechanism[J],2018,664:6-11.
APA	Shao, Wenting,Jiang, Bailing,Ma, Jun,&Zhang, Xinyu.(2018).Effect of cluster interface structure on the spontaneous escape behavior of silver in ion plating coatings and its inhibition mechanism.,664,6-11.
MLA	Shao, Wenting,et al."Effect of cluster interface structure on the spontaneous escape behavior of silver in ion plating coatings and its inhibition mechanism".664(2018):6-11.

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