| Thermal performance of microchannels with wavy walls for electronics cooling | |
| Gong, Liang; Kota, Krishna; Tao, Wenquan; Joshi, Yogendra | |
| 2010 | |
| 关键词 | Electronics cooling Heat transfer performance Hydraulic diameter Laminar fluid flow Low Reynolds number Micro channel heat sinks Thermal Performance Wavy channels |
| DOI | 10.1109/ITHERM.2010.5501323 |
| 会议录 | 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
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| URL标识 | 查看原文 |
| ISSN号 | 9781424453429 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4811606 |
| 专题 | 西安交通大学 |
| 推荐引用方式 GB/T 7714 | Gong, Liang,Kota, Krishna,Tao, Wenquan,et al. Thermal performance of microchannels with wavy walls for electronics cooling[C]. 见:. |
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