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	Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD
	Zhao, Xiaoqing; Sun, Hongbin; Liu, Longjun; Yang, Yang; Dai, Liangliang; Wu, Xiulong; Zhang, Ruizhi; Wang, Jianxiao; Zheng, Nanning
刊名	IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS
	2019
卷号	Vol.66 No.1页码:226-238
关键词	ReRAM solid state drive reliability endurance bit error rate
ISSN号	1549-8328
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4741330
专题	湖南大学
作者单位	1.Xi An Jiao Tong Univ, Sch Elect & Informat Engn, Xian 710049, Shaanxi, Peoples R China 2.Realsil Microelect, Suzhou, Peoples R China 3.Starblaze Technol, Shanghai, Peoples R China 4.Anhui Univ, Sch Elect & Informat Engn, Hefei 230601, Anhui, Peoples R China 5.Xi An Jiao Tong Univ, Sch Elect Engn, Xian 710049, Shaanxi, Peoples R China
推荐引用方式 GB/T 7714	Zhao, Xiaoqing,Sun, Hongbin,Liu, Longjun,et al. Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD[J]. IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS,2019,Vol.66 No.1:226-238.
APA	Zhao, Xiaoqing.,Sun, Hongbin.,Liu, Longjun.,Yang, Yang.,Dai, Liangliang.,...&Zheng, Nanning.(2019).Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD.IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS,Vol.66 No.1,226-238.
MLA	Zhao, Xiaoqing,et al."Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD".IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS Vol.66 No.1(2019):226-238.

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