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	Thermal conductivity and thermal expansion of few-layer h-BN/Cu composites
	Dongqin Wan; Xinzhi Wu; Wei Zhang; Kun Peng
刊名	Materials Research Bulletin
	2019
卷号	Vol.120页码:110606
关键词	Few-layer h-BN Composites Solvothermal method Anisotropic Thermal properties
ISSN号	0025-5408
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4614016
专题	湖南大学
作者单位	1.a College of Materials Science and Engineering, Hunan University, 410082, Changsha, China 2.Hunan Engineering Technology Research Center for Microwave Devices and Equipment, Hunan University, 410082, Changsha, China
推荐引用方式 GB/T 7714	Dongqin Wan,Xinzhi Wu,Wei Zhang,et al. Thermal conductivity and thermal expansion of few-layer h-BN/Cu composites[J]. Materials Research Bulletin,2019,Vol.120:110606.
APA	Dongqin Wan,Xinzhi Wu,Wei Zhang,&Kun Peng.(2019).Thermal conductivity and thermal expansion of few-layer h-BN/Cu composites.Materials Research Bulletin,Vol.120,110606.
MLA	Dongqin Wan,et al."Thermal conductivity and thermal expansion of few-layer h-BN/Cu composites".Materials Research Bulletin Vol.120(2019):110606.

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