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	Multiscale concurrent topology optimization of structures and microscopic multi-phase materials for thermal conductivity
	Daicong Da; Xiangyang Cui; Kai Long; Yong Cai; Guangyao Li
刊名	Engineering Computations
	2019
卷号	Vol.36 No.1页码:126-146
关键词	Thermal conductivity Inverse homogenization Multi-material topology optimization Multiscale concurrent design Bi-directional evolutionary structural optimization (BESO)
ISSN号	0264-4401
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4610172
专题	湖南大学
作者单位	State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, Hunan University, Changsha, China and Joint Center for Intelligent New Energy Vehicle, Shanghai, China
推荐引用方式 GB/T 7714	Daicong Da,Xiangyang Cui,Kai Long,et al. Multiscale concurrent topology optimization of structures and microscopic multi-phase materials for thermal conductivity[J]. Engineering Computations,2019,Vol.36 No.1:126-146.
APA	Daicong Da,Xiangyang Cui,Kai Long,Yong Cai,&Guangyao Li.(2019).Multiscale concurrent topology optimization of structures and microscopic multi-phase materials for thermal conductivity.Engineering Computations,Vol.36 No.1,126-146.
MLA	Daicong Da,et al."Multiscale concurrent topology optimization of structures and microscopic multi-phase materials for thermal conductivity".Engineering Computations Vol.36 No.1(2019):126-146.

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