Fabrication of high-hole-mobility germanium-on-insulator wafers through an easy method | |
Yu, Kai; Yang, Fan; Cong, Hui; Zhou, Lin; Liu, Qingyun; Zhang, Lichun; Cheng, Buwen; Xue, Chunlai; Zuo, Yuhua; Li, Chuanbo | |
刊名 | JOURNAL OF ALLOYS AND COMPOUNDS |
2018 | |
卷号 | 750页码:182-188 |
关键词 | GeOI High crystal quality Back-gate pMOSFET Field-effect hole mobility |
DOI | 10.1016/j.jallcom.2018.02.178 |
URL标识 | 查看原文 |
公开日期 | [db:dc_date_available] |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4564456 |
专题 | 山东大学 |
作者单位 | Chinese Acad Sci, Inst Semicond, State Key Lab Integra |
推荐引用方式 GB/T 7714 | Yu, Kai,Yang, Fan,Cong, Hui,et al. Fabrication of high-hole-mobility germanium-on-insulator wafers through an easy method[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2018,750:182-188. |
APA | Yu, Kai.,Yang, Fan.,Cong, Hui.,Zhou, Lin.,Liu, Qingyun.,...&Li, Chuanbo.(2018).Fabrication of high-hole-mobility germanium-on-insulator wafers through an easy method.JOURNAL OF ALLOYS AND COMPOUNDS,750,182-188. |
MLA | Yu, Kai,et al."Fabrication of high-hole-mobility germanium-on-insulator wafers through an easy method".JOURNAL OF ALLOYS AND COMPOUNDS 750(2018):182-188. |
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