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	Multi-field coupling analysis on the film-cooling with transverse and arched trenches
	Wang, Zhan; Zhang, Chao; Du, Wen-Jing; Li, Shu-Jia
刊名	Journal of Thermal Science and Technology
	2019
卷号	14期号:1
关键词	Film-cooling Flat-plate Multi-field coupling (MFC) Thermal-stress Trench
DOI	10.1299/jtst.2019jtst0012
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4545086
专题	山东大学
作者单位	1.School of Energy and Power Engineering, Shandong University, 17923 Jing-shi Road, Li-xia District, Jinan 2.250
推荐引用方式 GB/T 7714	Wang, Zhan,Zhang, Chao,Du, Wen-Jing,et al. Multi-field coupling analysis on the film-cooling with transverse and arched trenches[J]. Journal of Thermal Science and Technology,2019,14(1).
APA	Wang, Zhan,Zhang, Chao,Du, Wen-Jing,&Li, Shu-Jia.(2019).Multi-field coupling analysis on the film-cooling with transverse and arched trenches.Journal of Thermal Science and Technology,14(1).
MLA	Wang, Zhan,et al."Multi-field coupling analysis on the film-cooling with transverse and arched trenches".Journal of Thermal Science and Technology 14.1(2019).

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