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	A New Crack Healing Kinetic Model and Application of Crack Healing Diagram
	Kan, Y.; Liu, H.; Zhang, S. H.; Zhang, L. W.; Cheng, M.
刊名	JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME
	2013
卷号	135页码:-
关键词	crack healing model healing diagram crack surface topography grain growth
ISSN号	1087-1357
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4541419
专题	大连理工大学
作者单位	1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China. 3.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China. 4.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Kan, Y.,Liu, H.,Zhang, S. H.,et al. A New Crack Healing Kinetic Model and Application of Crack Healing Diagram[J]. JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME,2013,135:-.
APA	Kan, Y.,Liu, H.,Zhang, S. H.,Zhang, L. W.,&Cheng, M..(2013).A New Crack Healing Kinetic Model and Application of Crack Healing Diagram.JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME,135,-.
MLA	Kan, Y.,et al."A New Crack Healing Kinetic Model and Application of Crack Healing Diagram".JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME 135(2013):-.

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