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	Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process
	Wang, Yong; Bian, Cheng; Jing, Xinli
刊名	APPLIED SURFACE SCIENCE
	2013
卷号	271期号:[db:dc_citation_issue]页码:303-310
关键词	Electroless copper plating Sensitization Phenolic resin matrix composite Adhesion
ISSN号	0169-4332
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4449796
专题	西安交通大学
推荐引用方式 GB/T 7714	Wang, Yong,Bian, Cheng,Jing, Xinli. Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process[J]. APPLIED SURFACE SCIENCE,2013,271([db:dc_citation_issue]):303-310.
APA	Wang, Yong,Bian, Cheng,&Jing, Xinli.(2013).Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process.APPLIED SURFACE SCIENCE,271([db:dc_citation_issue]),303-310.
MLA	Wang, Yong,et al."Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process".APPLIED SURFACE SCIENCE 271.[db:dc_citation_issue](2013):303-310.

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