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	In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction
	Huang, M. L.; Yang, F.; Zhao, N.; Zhang, Z. J.
刊名	MATERIALS LETTERS
	2015
卷号	139页码:42-45
关键词	Synchrotron radiation Crystal growth Intermetallic alloys and compounds Precipitation Dissolution Cu6Sn5
ISSN号	0167-577X
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4405700
专题	大连理工大学
作者单位	Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Huang, M. L.,Yang, F.,Zhao, N.,et al. In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction[J]. MATERIALS LETTERS,2015,139:42-45.
APA	Huang, M. L.,Yang, F.,Zhao, N.,&Zhang, Z. J..(2015).In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction.MATERIALS LETTERS,139,42-45.
MLA	Huang, M. L.,et al."In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction".MATERIALS LETTERS 139(2015):42-45.

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