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	Positive Feedback on Imposed Thermal Gradient by Interfacial Bubbles in Cu/liquid Sn-3.5Ag/Cu Joints
	Kunwar, Anil; Ma, Haoran; Qi, Meng; Sun, Junhao; Qu, Lin; Guo, Bingfeng; Zhao, Ning; Wang, Yunpeng; Ma, Haitao
	2016
会议名称	17th International Conference on Electronic Packaging Technology (ICEPT)
会议日期	2016-08-16
会议地点	Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA
关键词	Soldering Synchrotron radiation Intermetallic compounds Thermal conductivity Finite element analysis
页码	608-611
会议录	17th International Conference on Electronic Packaging Technology (ICEPT)
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/4372259
专题	大连理工大学
作者单位	Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Kunwar, Anil,Ma, Haoran,Qi, Meng,et al. Positive Feedback on Imposed Thermal Gradient by Interfacial Bubbles in Cu/liquid Sn-3.5Ag/Cu Joints[C]. 见:17th International Conference on Electronic Packaging Technology (ICEPT). Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA. 2016-08-16.

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