| Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate | |
| Zhao, Zhong; Du, Liqun; Xu, Zheng; Shao, Ligeng | |
| 刊名 | ULTRASONICS SONOCHEMISTRY
 |
| 2016 | |
| 卷号 | 29页码:1-10 |
| 关键词 | MEMS Micro electroforming Ultrasonic agitation Adhesion strength Compressive stress Polarization |
| ISSN号 | 1350-4177 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4366996 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China. 3.Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Prov, Dalian 116024, Peoples R China. 4.Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Prov, Dalian 116024, Peoples R China. 5.Dalian Jiaotong Univ, Sch Elect Engn & Informat, Dalian, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Zhao, Zhong,Du, Liqun,Xu, Zheng,et al. Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate[J]. ULTRASONICS SONOCHEMISTRY,2016,29:1-10. |
| APA | Zhao, Zhong,Du, Liqun,Xu, Zheng,&Shao, Ligeng.(2016).Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate.ULTRASONICS SONOCHEMISTRY,29,1-10. |
| MLA | Zhao, Zhong,et al."Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate".ULTRASONICS SONOCHEMISTRY 29(2016):1-10. |
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