PRECURSOR FILM OF TIN-BASED ACTIVE SOLDER WETTING ON CERAMICS

CORC > 金属研究所 > 中国科学院金属研究所

	PRECURSOR FILM OF TIN-BASED ACTIVE SOLDER WETTING ON CERAMICS
	A. P. Xian
刊名	Journal of Materials Science
	1993
卷号	28 期号:4 页码:1019-1030
关键词	brazing filler metal joints solids
ISSN号	0022-2461
中文摘要	The phenomenon of the precursor film in a metal-ceramics wetting system was investigated using tin-based active solder (active element: Ti, Zr, Nb, V, Hf or Ta, the third element Ni, Cu, Ag, In or Al) wetting on the ceramics (sialon, mullite, barium titanate alumina and ZTA-SiC). The results show that the formation of a precursor film in the wetting system is dependent on the following factors. (1) The active metal: the presence of titanium, zirconium or hafnium in the solders induced the formation of a precursor film, but niobium, vanadium and tantalum did not. (2) Temperature: a precursor film will not form unless the critical wetting temperature is reached, while a weak film will form during a second wetting at higher temperature. (3) Ceramics: under the same wetting conditions for Sn-4Ti solder, a precursor film forms on the surface of sialon, ZTA-SiC, and red alumina, but not on white alumina, mullite or barium titanate. (4) The third element; small amounts of nickel (1-3 at %), copper (5 at %), or silver (5 at %) in Sn-5 at % Ti solder will enhance the precursor film. On the other hand, small amounts of Al (5 at %) will completely inhibit the occurrence of precursor film. SEM observation reveals the precursor film to be mainly composed of a continuous film with segregated active metal and some small tin islands on the film. Its thickness is several micrometres, similar to that of the interfacial reaction layer between the solder and the ceramic. Two early theories for the formation of a precursor film, surface diffusion and evaporation-condensation, cannot explain the above phenomenon very well. A new model of rapid absorption then film overflow is proposed here for the first time and some problems with the model are also discussed.
原文出处	://WOS:A1993KN48400026
公开日期	2012-04-14
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/39154]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	A. P. Xian. PRECURSOR FILM OF TIN-BASED ACTIVE SOLDER WETTING ON CERAMICS[J]. Journal of Materials Science,1993,28(4):1019-1030.
APA	A. P. Xian.(1993).PRECURSOR FILM OF TIN-BASED ACTIVE SOLDER WETTING ON CERAMICS.Journal of Materials Science,28(4),1019-1030.
MLA	A. P. Xian."PRECURSOR FILM OF TIN-BASED ACTIVE SOLDER WETTING ON CERAMICS".Journal of Materials Science 28.4(1993):1019-1030.