Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure

CORC > 金属研究所 > 中国科学院金属研究所

	Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure
	Q. L. Zeng ; Z. G. Wang ; A. P. Xian ; J. K. Shang
刊名	Journal of Electronic Materials
	2005
卷号	34 期号:1 页码:62-67
关键词	lead-free solder low-cycle fatigue cyclic softening Sn-3.8Ag-0.7Cu alloy sn-ag-cu fatigue behavior bi
ISSN号	0361-5235
中文摘要	Low-cycle fatigue behavior of the Sn-Ag-Cu ternary-eutectic alloy was investigated under a fully reversed loading condition. The solder alloy exhibited cyclic softening early in the fatigue life and continued to soften as the number of fatigue cycles increased. Following cyclic loading, numerous microcracks were found in the microstructure. Most of the microcracks were located along the grain boundaries in the areas with finer grains. The areal density of the microcracks increased with both strain amplitude and cycle number. By combining percolation theory with microcracking analysis, the cycle-dependent softening behavior: was shown to result from accumulation of microcrack density with fatigue cycles.
原文出处	://WOS:000226633900010
公开日期	2012-04-14
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/35193]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. L. Zeng,Z. G. Wang,A. P. Xian,et al. Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure[J]. Journal of Electronic Materials,2005,34(1):62-67.
APA	Q. L. Zeng,Z. G. Wang,A. P. Xian,&J. K. Shang.(2005).Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure.Journal of Electronic Materials,34(1),62-67.
MLA	Q. L. Zeng,et al."Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure".Journal of Electronic Materials 34.1(2005):62-67.