Temperature-dependent microstructures in fatigued ultrafine-grained copper produced by equal channel angular pressing

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	Temperature-dependent microstructures in fatigued ultrafine-grained copper produced by equal channel angular pressing
	X. W. Li ; S. D. Wu ; Y. Wu ; H. Y. Yasuda ; Y. Umakoshi
刊名	Advanced Engineering Materials
	2005
卷号	7 期号:9 页码:829-833
ISSN号	1438-1656
原文出处	://WOS:000233059500008
公开日期	2012-04-14
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/34908]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	X. W. Li,S. D. Wu,Y. Wu,et al. Temperature-dependent microstructures in fatigued ultrafine-grained copper produced by equal channel angular pressing[J]. Advanced Engineering Materials,2005,7(9):829-833.
APA	X. W. Li,S. D. Wu,Y. Wu,H. Y. Yasuda,&Y. Umakoshi.(2005).Temperature-dependent microstructures in fatigued ultrafine-grained copper produced by equal channel angular pressing.Advanced Engineering Materials,7(9),829-833.
MLA	X. W. Li,et al."Temperature-dependent microstructures in fatigued ultrafine-grained copper produced by equal channel angular pressing".Advanced Engineering Materials 7.9(2005):829-833.