Work hardening of ultrafine-grained copper with nanoscale twins

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	Work hardening of ultrafine-grained copper with nanoscale twins
	X. H. Chen ; L. Lu
刊名	Scripta Materialia
	2007
卷号	57 期号:2 页码:133-136
关键词	ultrafine-grained copper nanoscale twins work hardening rate work hardening coefficient nanocrystalline copper ultrahigh-strength deformation nickel ductility behavior metals
ISSN号	1359-6462
中文摘要	Work hardening behaviors of electrodeposited ultrafine-grained Cu with nanoscale growth twins are investigated by means of uniaxial continuous tensile and loading-unloading tests. A high density of nanoscale twins leads to a significant enhancement in flow strength and work hardening rate, while the work hardening coefficient (n) does not show any obvious variation with the twin density. These effects were analyzed in terms of the post-deformation microstructures. (C) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
原文出处	://WOS:000247059800016
公开日期	2012-04-13
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/33460]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	X. H. Chen,L. Lu. Work hardening of ultrafine-grained copper with nanoscale twins[J]. Scripta Materialia,2007,57(2):133-136.
APA	X. H. Chen,&L. Lu.(2007).Work hardening of ultrafine-grained copper with nanoscale twins.Scripta Materialia,57(2),133-136.
MLA	X. H. Chen,et al."Work hardening of ultrafine-grained copper with nanoscale twins".Scripta Materialia 57.2(2007):133-136.