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The formation of stacking fault tetrahedra in Al and Cu II SFT growth by successive absorption of vacancies generated by dipole annihilation
H. Wang ; D. S. Xu ; R. Yang ; P. Veyssiere
刊名Acta Materialia
2011
卷号59期号:1页码:41200
关键词Stacking fault tetrahedron Dislocation dipole Dislocation annihilation Molecular dynamics simulations Vacancy cluster edge-dislocation dipoles fcc metals tensile properties single-crystals quenched gold temperature-dependence point-defects atomic-scale part i copper
ISSN号1359-6454
中文摘要The growth of stacking fault tetrahedra (SFTs) resulting from dipole annihilation is investigated by molecular dynamics (MD) simulations The atomistic processes Involved during growth immediately after nucleation are studied Analyzed for up to three vacancies the site preference of vacancies on a perfect SFT favors vacancy segregation at edge centers and corners in Cu and Al, respectively The formation of small sized SFTs does not require a prior triangular Frank loop Instead, SFT growth involves vacancies and their clusters agglomerating as complex faceted configurations which assisted by accelerated vacancy migration along SFT edges rearrange into near perfect and perfect SFTs SFT growth by the ledge mechanism is investigated in Part III (C) 2010 Acta Materialia Inc Published by Elsevier Ltd All rights reserved
原文出处://WOS:000284789200002
公开日期2012-04-13
内容类型期刊论文
源URL[http://ir.imr.ac.cn/handle/321006/30724]  
专题金属研究所_中国科学院金属研究所
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H. Wang,D. S. Xu,R. Yang,et al. The formation of stacking fault tetrahedra in Al and Cu II SFT growth by successive absorption of vacancies generated by dipole annihilation[J]. Acta Materialia,2011,59(1):41200.
APA H. Wang,D. S. Xu,R. Yang,&P. Veyssiere.(2011).The formation of stacking fault tetrahedra in Al and Cu II SFT growth by successive absorption of vacancies generated by dipole annihilation.Acta Materialia,59(1),41200.
MLA H. Wang,et al."The formation of stacking fault tetrahedra in Al and Cu II SFT growth by successive absorption of vacancies generated by dipole annihilation".Acta Materialia 59.1(2011):41200.
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