Fracture properties of silicon carbide thin films by bulge test of long rectangular membrane

	Fracture properties of silicon carbide thin films by bulge test of long rectangular membrane
	Zhou, W ; Yang, JL ; Sun, GS ; Liu, XF ; Yang, FH ; Li, JM
刊名	IEEE JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
	2008
卷号	17 期号:5 Pages 页码:453-461
公开日期	2012-05-12
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/108867]
专题	上海微系统与信息技术研究所_传感技术联合国家重点实验室_期刊论文
推荐引用方式 GB/T 7714	Zhou, W,Yang, JL,Sun, GS,et al. Fracture properties of silicon carbide thin films by bulge test of long rectangular membrane[J]. IEEE JOURNAL OF MICROELECTROMECHANICAL SYSTEMS,2008,17(5 Pages):453-461.
APA	Zhou, W,Yang, JL,Sun, GS,Liu, XF,Yang, FH,&Li, JM.(2008).Fracture properties of silicon carbide thin films by bulge test of long rectangular membrane.IEEE JOURNAL OF MICROELECTROMECHANICAL SYSTEMS,17(5 Pages),453-461.
MLA	Zhou, W,et al."Fracture properties of silicon carbide thin films by bulge test of long rectangular membrane".IEEE JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 17.5 Pages(2008):453-461.