Complexing Between Additives and Ceria Abrasives Used for Polishing Silicon Dioxide and Silicon Nitride Films
Wang,LY ; Liu,B ; Song,ZT ; Liu,WL ; Feng,SL ; Huang,D ; Babu,SV
刊名ELECTROCHEMICAL AND SOLID STATE LETTERS
2011
卷号14期号:3页码:H128-H131
关键词ELECTROCHEMICAL SOC INC
ISSN号1099-0062
学科主题Electrochemistry; Materials Science ; Multidisciplinary
公开日期2012-04-10
内容类型期刊论文
源URL[http://ir.sim.ac.cn/handle/331004/106775]  
专题上海微系统与信息技术研究所_功能材料与器件_期刊论文
推荐引用方式
GB/T 7714
Wang,LY,Liu,B,Song,ZT,et al. Complexing Between Additives and Ceria Abrasives Used for Polishing Silicon Dioxide and Silicon Nitride Films[J]. ELECTROCHEMICAL AND SOLID STATE LETTERS,2011,14(3):H128-H131.
APA Wang,LY.,Liu,B.,Song,ZT.,Liu,WL.,Feng,SL.,...&Babu,SV.(2011).Complexing Between Additives and Ceria Abrasives Used for Polishing Silicon Dioxide and Silicon Nitride Films.ELECTROCHEMICAL AND SOLID STATE LETTERS,14(3),H128-H131.
MLA Wang,LY,et al."Complexing Between Additives and Ceria Abrasives Used for Polishing Silicon Dioxide and Silicon Nitride Films".ELECTROCHEMICAL AND SOLID STATE LETTERS 14.3(2011):H128-H131.
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