Ti, TiN, and Ti/TiN thin films prepared by ion beam assisted deposition as diffusion barriers between Cu and Si

	Ti, TiN, and Ti/TiN thin films prepared by ion beam assisted deposition as diffusion barriers between Cu and Si
	Mu, HC ; Yu, YH ; Luo, EZ ; Sundaravel, B ; Wong, SP ; Wilson, IH
刊名	JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
	2000
卷号	18 期号:5 页码:2312-2318
关键词	TRANSITION-METALS COPPER METALLIZATION LAYERS SILICON MO TA
ISSN号	0734-2101
通讯作者	Mu, HC, Chinese Acad Sci, Shanghai Inst Met, Ion Beam Lab, 865 ChangNing Rd, Shanghai 200050, Peoples R China
学科主题	Materials Science, Coatings & Films; Physics, Applied
收录类别	SCI
语种	英语
公开日期	2012-03-24
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/95839]
专题	上海微系统与信息技术研究所_功能材料与器件_期刊论文
推荐引用方式 GB/T 7714	Mu, HC,Yu, YH,Luo, EZ,et al. Ti, TiN, and Ti/TiN thin films prepared by ion beam assisted deposition as diffusion barriers between Cu and Si[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,2000,18(5):2312-2318.
APA	Mu, HC,Yu, YH,Luo, EZ,Sundaravel, B,Wong, SP,&Wilson, IH.(2000).Ti, TiN, and Ti/TiN thin films prepared by ion beam assisted deposition as diffusion barriers between Cu and Si.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,18(5),2312-2318.
MLA	Mu, HC,et al."Ti, TiN, and Ti/TiN thin films prepared by ion beam assisted deposition as diffusion barriers between Cu and Si".JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS 18.5(2000):2312-2318.