Cation Effect on Copper Chemical Mechanical Polishing

	Cation Effect on Copper Chemical Mechanical Polishing
	Wang, LY ; Liu, B ; Song, ZT ; Feng, SL
刊名	CHINESE PHYSICS LETTERS
	2009
卷号	26 期号:2 页码:28103-28103
关键词	SLURRY CMP BENZOTRIAZOLE PLANARIZATION MEDIA GLASS ACID
ISSN号	0256-307X
通讯作者	Wang, LY, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Lab Nanotechnol, Shanghai 200050, Peoples R China
学科主题	Physics, Multidisciplinary
收录类别	SCI
语种	英语
公开日期	2012-03-24
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/94800]
专题	上海微系统与信息技术研究所_功能材料与器件_期刊论文
推荐引用方式 GB/T 7714	Wang, LY,Liu, B,Song, ZT,et al. Cation Effect on Copper Chemical Mechanical Polishing[J]. CHINESE PHYSICS LETTERS,2009,26(2):28103-28103.
APA	Wang, LY,Liu, B,Song, ZT,&Feng, SL.(2009).Cation Effect on Copper Chemical Mechanical Polishing.CHINESE PHYSICS LETTERS,26(2),28103-28103.
MLA	Wang, LY,et al."Cation Effect on Copper Chemical Mechanical Polishing".CHINESE PHYSICS LETTERS 26.2(2009):28103-28103.