| Additives-assisted electrodeposition of fine spherical copper powder from sulfuric acid solution | |
| Lou, Wenbo; Cai, Weiquan; Li, Ping; Su, Junling; Zheng, Shili; Zhang, Yi; Jin, Wei* | |
| 刊名 | Powder Technology
 |
| 2018 | |
| 卷号 | 326页码:84-88 |
| 关键词 | Electrodeposition Copper recovery Spherical powder Additives effect |
| ISSN号 | 0032-5910 |
| DOI | 10.1016/j.powtec.2017.12.060 |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000425077200012;EI:20175204575529 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3378399 |
| 专题 | 武汉理工大学 |
| 作者单位 | [Lou, Wenbo] Northeastern Univ, Sch Met, Shenyang 110819, Liaoning, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Lou, Wenbo,Cai, Weiquan,Li, Ping,et al. Additives-assisted electrodeposition of fine spherical copper powder from sulfuric acid solution[J]. Powder Technology,2018,326:84-88. |
| APA | Lou, Wenbo.,Cai, Weiquan.,Li, Ping.,Su, Junling.,Zheng, Shili.,...&Jin, Wei*.(2018).Additives-assisted electrodeposition of fine spherical copper powder from sulfuric acid solution.Powder Technology,326,84-88. |
| MLA | Lou, Wenbo,et al."Additives-assisted electrodeposition of fine spherical copper powder from sulfuric acid solution".Powder Technology 326(2018):84-88. |
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