| Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder | |
| Wang, Qiwei; Xiao, Yong*; Zhang, Xingyi | |
| 2017 | |
| 会议名称 | 18th International Conference on Electronic Packaging Technology (ICEPT) |
| 会议日期 | AUG 16-19, 2017 |
| 会议地点 | IEEE, Harbin, PEOPLES R CHINA |
| 关键词 | ultrasonic vibration intermetallic compound Ni-Sn composite solder microstructure shear strength |
| 页码 | 875-878 |
| 会议录 | 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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| URL标识 | 查看原文 |
| WOS记录号 | WOS:000431392000191 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3371935 |
| 专题 | 武汉理工大学 |
| 作者单位 | 1.[Zhang, Xingyi 2.Xiao, Yong 3.Wang, Qiwei] Wuhan Univ Technol, Sch Mat Sci & Engn, Wuhan, Hubei, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Wang, Qiwei,Xiao, Yong*,Zhang, Xingyi. Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder[C]. 见:18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, Harbin, PEOPLES R CHINA. AUG 16-19, 2017. |
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