| Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications | |
| Yu Kun*; Li Shaojun; Chen Lisan; Zhao Weishang; Li Pengfei | |
| 刊名 | Transactions of Nonferrous Metals Society of China
 |
| 2012 | |
| 卷号 | 22期号:6页码:1412-1417 |
| 关键词 | Si-Al alloy rapid solidification thermal properties electronic packaging application |
| ISSN号 | 1003-6326 |
| DOI | 10.1016/S1003-6326(11)61334-4 |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000306275100022;EI:20122915252957 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3339248 |
| 专题 | 中南大学 |
| 作者单位 | 1.[Li Shaojun 2.Yu Kun] Cent S Univ, Sch Mat Sci & Engn, Changsha 410083, Hunan, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Yu Kun*,Li Shaojun,Chen Lisan,et al. Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications[J]. Transactions of Nonferrous Metals Society of China,2012,22(6):1412-1417. |
| APA | Yu Kun*,Li Shaojun,Chen Lisan,Zhao Weishang,&Li Pengfei.(2012).Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications.Transactions of Nonferrous Metals Society of China,22(6),1412-1417. |
| MLA | Yu Kun*,et al."Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications".Transactions of Nonferrous Metals Society of China 22.6(2012):1412-1417. |
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