| New encapsulation method using low-melting-point alloy for sealing micro heat pipes | |
| Li, Congming; Wang, Xiaodong; Zhou, Chuanpeng; Luo, Yi; Li, Zhixin; Li, Sidi | |
| 刊名 | Joint 18th International Heat Pipe Conference (IHPC) / 12th International Heat Pipe Symposium (IHPS)
 |
| 2017 | |
| 卷号 | 31页码:2621-2626 |
| 关键词 | Encapsulation Low-melting-point alloy Micro heat pipe Sealing |
| ISSN号 | 1738-494X |
| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3285689 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Prov, Dalian 116023, Peoples R China. 2.Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Prov, Dalian 116023, Peoples R China. 3.Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining, Dalian 116023, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Li, Congming,Wang, Xiaodong,Zhou, Chuanpeng,et al. New encapsulation method using low-melting-point alloy for sealing micro heat pipes[J]. Joint 18th International Heat Pipe Conference (IHPC) / 12th International Heat Pipe Symposium (IHPS),2017,31:2621-2626. |
| APA | Li, Congming,Wang, Xiaodong,Zhou, Chuanpeng,Luo, Yi,Li, Zhixin,&Li, Sidi.(2017).New encapsulation method using low-melting-point alloy for sealing micro heat pipes.Joint 18th International Heat Pipe Conference (IHPC) / 12th International Heat Pipe Symposium (IHPS),31,2621-2626. |
| MLA | Li, Congming,et al."New encapsulation method using low-melting-point alloy for sealing micro heat pipes".Joint 18th International Heat Pipe Conference (IHPC) / 12th International Heat Pipe Symposium (IHPS) 31(2017):2621-2626. |
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