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	Effects of void-crack interaction and void distribution on crack propagation in single crystal silicon
	Wang, Liang; Liu, Qunfeng; Shen, Shengping
刊名	ENGINEERING FRACTURE MECHANICS
	2015
卷号	146期号:[db:dc_citation_issue]页码:56-66
关键词	Fracture toughness Crack-void interaction Void-void interaction Single crystal silicon
ISSN号	0013-7944
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3266787
专题	西安交通大学
推荐引用方式 GB/T 7714	Wang, Liang,Liu, Qunfeng,Shen, Shengping. Effects of void-crack interaction and void distribution on crack propagation in single crystal silicon[J]. ENGINEERING FRACTURE MECHANICS,2015,146([db:dc_citation_issue]):56-66.
APA	Wang, Liang,Liu, Qunfeng,&Shen, Shengping.(2015).Effects of void-crack interaction and void distribution on crack propagation in single crystal silicon.ENGINEERING FRACTURE MECHANICS,146([db:dc_citation_issue]),56-66.
MLA	Wang, Liang,et al."Effects of void-crack interaction and void distribution on crack propagation in single crystal silicon".ENGINEERING FRACTURE MECHANICS 146.[db:dc_citation_issue](2015):56-66.

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