QQ客服 官方微博 反馈留言

	Reducing the residual stress in micro electroforming layer by megasonic agitation
	Song, Chang; Du, Liqun; Ji, Xuechao
刊名	ULTRASONICS SONOCHEMISTRY
	2018
卷号	49页码:233-240
关键词	Megasonic agitation Micro electroforming Residual stress Dislocation density Acoustic cavitation Crystal orientation
ISSN号	1350-4177
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3259068
专题	大连理工大学
作者单位	1.Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China. 3.Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Prov, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Song, Chang,Du, Liqun,Ji, Xuechao. Reducing the residual stress in micro electroforming layer by megasonic agitation[J]. ULTRASONICS SONOCHEMISTRY,2018,49:233-240.
APA	Song, Chang,Du, Liqun,&Ji, Xuechao.(2018).Reducing the residual stress in micro electroforming layer by megasonic agitation.ULTRASONICS SONOCHEMISTRY,49,233-240.
MLA	Song, Chang,et al."Reducing the residual stress in micro electroforming layer by megasonic agitation".ULTRASONICS SONOCHEMISTRY 49(2018):233-240.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。