| Effects of Process Parameters on Material Removal in Vibration-Assisted Polishing of Micro-Optic Mold | |
| Guo, Jiang; Suzuki, Hirofumi | |
| 刊名 | MICROMACHINES
 |
| 2018 | |
| 卷号 | 9 |
| 关键词 | polishing pressure vibration material removal roughness tungsten carbide tool wear |
| ISSN号 | 2072-666X |
| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3257178 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China. 2.Chubu Univ, Dept Mech Engn, 1200 Matsumoto Cho, Kasugai, Aichi 4878501, Japan. |
| 推荐引用方式 GB/T 7714 | Guo, Jiang,Suzuki, Hirofumi. Effects of Process Parameters on Material Removal in Vibration-Assisted Polishing of Micro-Optic Mold[J]. MICROMACHINES,2018,9. |
| APA | Guo, Jiang,&Suzuki, Hirofumi.(2018).Effects of Process Parameters on Material Removal in Vibration-Assisted Polishing of Micro-Optic Mold.MICROMACHINES,9. |
| MLA | Guo, Jiang,et al."Effects of Process Parameters on Material Removal in Vibration-Assisted Polishing of Micro-Optic Mold".MICROMACHINES 9(2018). |
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