| REAXFF MOLECULAR DYNAMICS SIMULATION OF MATERIAL REMOVAL MECHANISMS DURING CMP PROCESS OF SILICA GLASS IN AQUEOUS H2O2 | |
| Guo, Xiaoguang; Chen, Chong; Kang, Renke; Jin, Zhuji | |
| 2019 | |
| 会议名称 | 2019 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC) |
| 会议日期 | 2019-01-01 |
| 会议录 | 2019 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC)
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| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3230151 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Sch Mech Engn, Dalian 116000, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Guo, Xiaoguang,Chen, Chong,Kang, Renke,et al. REAXFF MOLECULAR DYNAMICS SIMULATION OF MATERIAL REMOVAL MECHANISMS DURING CMP PROCESS OF SILICA GLASS IN AQUEOUS H2O2[C]. 见:2019 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC). 2019-01-01. |
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