Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface | |
Zhu, Zhidan; Ma, Haoran; Shang, Shengyan; Ma, Haitao; Wang, Yunpeng; Li, Xiaogan | |
刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
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2019 | |
卷号 | 30页码:15964-15971 |
ISSN号 | 0957-4522 |
URL标识 | 查看原文 |
WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3227531 |
专题 | 大连理工大学 |
作者单位 | 1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Sch Microelect, Dalian 116024, Peoples R China. |
推荐引用方式 GB/T 7714 | Zhu, Zhidan,Ma, Haoran,Shang, Shengyan,et al. Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30:15964-15971. |
APA | Zhu, Zhidan,Ma, Haoran,Shang, Shengyan,Ma, Haitao,Wang, Yunpeng,&Li, Xiaogan.(2019).Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30,15964-15971. |
MLA | Zhu, Zhidan,et al."Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30(2019):15964-15971. |
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