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Near-field microscopy inspection of nano scratch defects on the monocrystalline silicon surface
Yan, Ying; Wang, Yonghao; Zhou, Ping; Huang, Ning; Guo, Dongming
刊名PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
2019
卷号56页码:506-512
关键词s-SNOM Surface defects Micro crack
ISSN号0141-6359
URL标识查看原文
WOS记录号[DB:DC_IDENTIFIER_WOSID]
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/3219275
专题大连理工大学
作者单位Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China.
推荐引用方式
GB/T 7714
Yan, Ying,Wang, Yonghao,Zhou, Ping,et al. Near-field microscopy inspection of nano scratch defects on the monocrystalline silicon surface[J]. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2019,56:506-512.
APA Yan, Ying,Wang, Yonghao,Zhou, Ping,Huang, Ning,&Guo, Dongming.(2019).Near-field microscopy inspection of nano scratch defects on the monocrystalline silicon surface.PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,56,506-512.
MLA Yan, Ying,et al."Near-field microscopy inspection of nano scratch defects on the monocrystalline silicon surface".PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY 56(2019):506-512.
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